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Secure Intelligent Reflecting Surface Aided Integrated Sensing and Communication


Jul 19, 2022
Meng Hua, Qingqing Wu, Wen Chen, Octavia A. Dobre, A. Lee Swindlehurst

* This paper has been submitted to IEEE journal for possible publication 

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Secure UAV-to-Ground MIMO Communications: Joint Transceiver and Location Optimization


Jul 10, 2022
Zhong Zheng, Xinyao Wang, Zesong Fei, Qingqing Wu, Bin Li, Lajos Hanzo

* 15 pages, 11 figures. To appear in IEEE Transactions on Vehicular Technology 

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Intelligent Reflecting Surface Enabled Multi-Target Sensing


Jul 04, 2022
Kaitao Meng, Qingqing Wu, Robert Schober, Wen Chen

* 31 pages. This work has been submitted to the IEEE for possible publication 

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Performance-Oriented Design for Intelligent Reflecting Surface Assisted Federated Learning


Jun 20, 2022
Yapeng Zhao, Qingqing Wu, Wen Chen

* This work has been submitted to the IEEE for possible publication 

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Delay-aware Multiple Access Design for Intelligent Reflecting Surface Aided Uplink Transmission


Jun 19, 2022
Piao Zeng, Guangji Chen, Qingqing Wu, Deli Qiao

* Submitted to TCOM 

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IRS Aided MEC Systems with Binary Offloading: A Unified Framework for Dynamic IRS Beamforming


May 29, 2022
Guangji Chen, Qingqing Wu


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Achieving Multi-beam Gain in Intelligent Reflecting Surface Assisted Wireless Energy Transfer


May 18, 2022
Chi Qiu, Qingqing Wu, Meng Hua, Xinrong guan, Yuan Wu


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IRS-assisted Multi-cell Multi-band Systems: Practical Reflection Model and Joint Beamforming Design


Apr 13, 2022
Wenhao Cai, Rang Liu, Ming Li, Yang Liu, Qingqing Wu, Qian Liu

* 14 pages, 13 figures, to appear in IEEE Transactions on Communications 

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Throughput Maximization for UAV-enabled Integrated Periodic Sensing and Communication


Mar 31, 2022
Kaitao Meng, Qingqing Wu, Shaodan Ma, Wen Chen, Kunlun Wang, Jun Li

* 32 pages, This work has been submitted to the IEEE for possible publication 

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Beamforming Optimization for Active Intelligent Reflecting Surface-Aided SWIPT


Mar 30, 2022
Ying Gao, Qingqing Wu, Guangchi Zhang, Wen Chen, Derrick Wing Kwan Ng, Marco Di Renzo

* 30 pages, 10 figures, submitted to IEEE journal for possible publication 

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