Assessing Economic Viability: A Comparative Analysis of Total Cost of Ownership for Domain-Adapted Large Language Models versus State-of-the-art Counterparts in Chip Design Coding Assistance

This paper presents a comparative analysis of total cost of ownership (TCO) and performance between domain-adapted large language models (LLM) and state-of-the-art (SoTA) LLMs , with a particular emphasis on tasks related to coding assistance for chip design. We examine the TCO and performance metrics of a domain-adaptive LLM, ChipNeMo, against two leading LLMs, Claude 3 Opus and ChatGPT-4 Turbo, to assess their efficacy in chip design coding generation. Through a detailed evaluation of the accuracy of the model, training methodologies, and operational expenditures, this study aims to provide stakeholders with critical information to select the most economically viable and performance-efficient solutions for their specific needs. Our results underscore the benefits of employing domain-adapted models, such as ChipNeMo, that demonstrate improved performance at significantly reduced costs compared to their general-purpose counterparts. In particular, we reveal the potential of domain-adapted LLMs to decrease TCO by approximately 90%-95%, with the cost advantages becoming increasingly evident as the deployment scale expands. With expansion of deployment, the cost benefits of ChipNeMo become more pronounced, making domain-adaptive LLMs an attractive option for organizations with substantial coding needs supported by LLMs

Optimizing Predictive AI in Physical Design Flows with Mini Pixel Batch Gradient Descent

Exploding predictive AI has enabled fast yet effective evaluation and decision-making in modern chip physical design flows. State-of-the-art frameworks typically include the objective of minimizing the mean square error (MSE) between the prediction and the ground truth. We argue the averaging effect of MSE induces limitations in both model training and deployment, and good MSE behavior does not guarantee the capability of these models to assist physical design flows which are likely sabotaged due to a small portion of prediction error. To address this, we propose mini-pixel batch gradient descent (MPGD), a plug-and-play optimization algorithm that takes the most informative entries into consideration, offering probably faster and better convergence. Experiments on representative benchmark suits show the significant benefits of MPGD on various physical design prediction tasks using CNN or Graph-based models.

BoolGebra: Attributed Graph-learning for Boolean Algebraic Manipulation

Boolean algebraic manipulation is at the core of logic synthesis in Electronic Design Automation (EDA) design flow. Existing methods struggle to fully exploit optimization opportunities, and often suffer from an explosive search space and limited scalability efficiency. This work presents BoolGebra, a novel attributed graph-learning approach for Boolean algebraic manipulation that aims to improve fundamental logic synthesis. BoolGebra incorporates Graph Neural Networks (GNNs) and takes initial feature embeddings from both structural and functional information as inputs. A fully connected neural network is employed as the predictor for direct optimization result predictions, significantly reducing the search space and efficiently locating the optimization space. The experiments involve training the BoolGebra model w.r.t design-specific and cross-design inferences using the trained model, where BoolGebra demonstrates generalizability for cross-design inference and its potential to scale from small, simple training datasets to large, complex inference datasets. Finally, BoolGebra is integrated with existing synthesis tool ABC to perform end-to-end logic minimization evaluation w.r.t SOTA baselines.

ChipNeMo: Domain-Adapted LLMs for Chip Design

ChipNeMo aims to explore the applications of large language models (LLMs) for industrial chip design. Instead of directly deploying off-the-shelf commercial or open-source LLMs, we instead adopt the following domain adaptation techniques: custom tokenizers, domain-adaptive continued pretraining, supervised fine-tuning (SFT) with domain-specific instructions, and domain-adapted retrieval models. We evaluate these methods on three selected LLM applications for chip design: an engineering assistant chatbot, EDA script generation, and bug summarization and analysis. Our results show that these domain adaptation techniques enable significant LLM performance improvements over general-purpose base models across the three evaluated applications, enabling up to 5x model size reduction with similar or better performance on a range of design tasks. Our findings also indicate that there's still room for improvement between our current results and ideal outcomes. We believe that further investigation of domain-adapted LLM approaches will help close this gap in the future.

VerilogEval: Evaluating Large Language Models for Verilog Code Generation

The increasing popularity of large language models (LLMs) has paved the way for their application in diverse domains. This paper proposes a benchmarking framework tailored specifically for evaluating LLM performance in the context of Verilog code generation for hardware design and verification. We present a comprehensive evaluation dataset consisting of 156 problems from the Verilog instructional website HDLBits. The evaluation set consists of a diverse set of Verilog code generation tasks, ranging from simple combinational circuits to complex finite state machines. The Verilog code completions can be automatically tested for functional correctness by comparing the transient simulation outputs of the generated design with a golden solution. We also demonstrate that the Verilog code generation capability of pretrained language models could be improved with supervised fine-tuning by bootstrapping with LLM generated synthetic problem-code pairs.

An Adversarial Active Sampling-based Data Augmentation Framework for Manufacturable Chip Design

Lithography modeling is a crucial problem in chip design to ensure a chip design mask is manufacturable. It requires rigorous simulations of optical and chemical models that are computationally expensive. Recent developments in machine learning have provided alternative solutions in replacing the time-consuming lithography simulations with deep neural networks. However, the considerable accuracy drop still impedes its industrial adoption. Most importantly, the quality and quantity of the training dataset directly affect the model performance. To tackle this problem, we propose a litho-aware data augmentation (LADA) framework to resolve the dilemma of limited data and improve the machine learning model performance. First, we pretrain the neural networks for lithography modeling and a gradient-friendly StyleGAN2 generator. We then perform adversarial active sampling to generate informative and synthetic in-distribution mask designs. These synthetic mask images will augment the original limited training dataset used to finetune the lithography model for improved performance. Experimental results demonstrate that LADA can successfully exploits the neural network capacity by narrowing down the performance gap between the training and testing data instances.

TAG: Learning Circuit Spatial Embedding From Layouts

Analog and mixed-signal (AMS) circuit designs still rely on human design expertise. Machine learning has been assisting circuit design automation by replacing human experience with artificial intelligence. This paper presents TAG, a new paradigm of learning the circuit representation from layouts leveraging text, self-attention and graph. The embedding network model learns spatial information without manual labeling. We introduce text embedding and a self-attention mechanism to AMS circuit learning. Experimental results demonstrate the ability to predict layout distances between instances with industrial FinFET technology benchmarks. The effectiveness of the circuit representation is verified by showing the transferability to three other learning tasks with limited data in the case studies: layout matching prediction, wirelength estimation, and net parasitic capacitance prediction.

Large Scale Mask Optimization Via Convolutional Fourier Neural Operator and Litho-Guided Self Training

Machine learning techniques have been extensively studied for mask optimization problems, aiming at better mask printability, shorter turnaround time, better mask manufacturability, and so on. However, most of these researches are focusing on the initial solution generation of small design regions. To further realize the potential of machine learning techniques on mask optimization tasks, we present a Convolutional Fourier Neural Operator (CFNO) that can efficiently learn layout tile dependencies and hence promise stitch-less large-scale mask optimization with the limited intervention of legacy tools. We discover the possibility of litho-guided self-training (LGST) through a trained machine learning model when solving non-convex optimization problems, which allows iterative model and dataset update and brings significant model performance improvement. Experimental results show that, for the first time, our machine learning-based framework outperforms state-of-the-art academic numerical mask optimizers with an order of magnitude speedup.

Generic Lithography Modeling with Dual-band Optics-Inspired Neural Networks

Lithography simulation is a critical step in VLSI design and optimization for manufacturability. Existing solutions for highly accurate lithography simulation with rigorous models are computationally expensive and slow, even when equipped with various approximation techniques. Recently, machine learning has provided alternative solutions for lithography simulation tasks such as coarse-grained edge placement error regression and complete contour prediction. However, the impact of these learning-based methods has been limited due to restrictive usage scenarios or low simulation accuracy. To tackle these concerns, we introduce an dual-band optics-inspired neural network design that considers the optical physics underlying lithography. To the best of our knowledge, our approach yields the first published via/metal layer contour simulation at 1nm^2/pixel resolution with any tile size. Compared to previous machine learning based solutions, we demonstrate that our framework can be trained much faster and offers a significant improvement on efficiency and image quality with 20X smaller model size. We also achieve 85X simulation speedup over traditional lithography simulator with 1% accuracy loss.