Differentiable Architecture Search for Adversarially Robust Quantum Computer Vision

Current quantum neural networks suffer from extreme sensitivity to both adversarial perturbations and hardware noise, creating a significant barrier to real-world deployment. Existing robustness techniques typically sacrifice clean accuracy or require prohibitive computational resources. We propose a hybrid quantum-classical Differentiable Quantum Architecture Search (DQAS) framework that addresses these limitations by jointly optimizing circuit structure and robustness through gradient-based methods. Our approach enhances traditional DQAS with a lightweight Classical Noise Layer applied before quantum processing, enabling simultaneous optimization of gate selection and noise parameters. This design preserves the quantum circuit's integrity while introducing trainable perturbations that enhance robustness without compromising standard performance. Experimental validation on MNIST, FashionMNIST, and CIFAR datasets shows consistent improvements in both clean and adversarial accuracy compared to existing quantum architecture search methods. Under various attack scenarios, including Fast Gradient Sign Method (FGSM), Projected Gradient Descent (PGD), Basic Iterative Method (BIM), and Momentum Iterative Method (MIM), and under realistic quantum noise conditions, our hybrid framework maintains superior performance. Testing on actual quantum hardware confirms the practical viability of discovered architectures. These results demonstrate that strategic classical preprocessing combined with differentiable quantum architecture optimization can significantly enhance quantum neural network robustness while maintaining computational efficiency.

In-Situ Thickness Measurement of Die Silicon Using Voltage Imaging for Hardware Assurance

Hardware assurance of electronics is a challenging task and is of great interest to the government and the electronics industry. Physical inspection-based methods such as reverse engineering (RE) and Trojan scanning (TS) play an important role in hardware assurance. Therefore, there is a growing demand for automation in RE and TS. Many state-of-the-art physical inspection methods incorporate an iterative imaging and delayering workflow. In practice, uniform delayering can be challenging if the thickness of the initial layer of material is non-uniform. Moreover, this non-uniformity can reoccur at any stage during delayering and must be corrected. Therefore, it is critical to evaluate the thickness of the layers to be removed in a real-time fashion. Our proposed method uses electron beam voltage imaging, image processing, and Monte Carlo simulation to measure the thickness of remaining silicon to guide a uniform delayering process