Printed Electronics (PE) stands out as a promisingtechnology for widespread computing due to its distinct attributes, such as low costs and flexible manufacturing. Unlike traditional silicon-based technologies, PE enables stretchable, conformal,and non-toxic hardware. However, PE are constrained by larger feature sizes, making it challenging to implement complex circuits such as machine learning (ML) classifiers. Approximate computing has been proven to reduce the hardware cost of ML circuits such as Multilayer Perceptrons (MLPs). In this paper, we maximize the benefits of approximate computing by integrating hardware approximation into the MLP training process. Due to the discrete nature of hardware approximation, we propose and implement a genetic-based, approximate, hardware-aware training approach specifically designed for printed MLPs. For a 5% accuracy loss, our MLPs achieve over 5x area and power reduction compared to the baseline while outperforming state of-the-art approximate and stochastic printed MLPs.
Bayesian Neural Networks (BayNNs) naturally provide uncertainty in their predictions, making them a suitable choice in safety-critical applications. Additionally, their realization using memristor-based in-memory computing (IMC) architectures enables them for resource-constrained edge applications. In addition to predictive uncertainty, however, the ability to be inherently robust to noise in computation is also essential to ensure functional safety. In particular, memristor-based IMCs are susceptible to various sources of non-idealities such as manufacturing and runtime variations, drift, and failure, which can significantly reduce inference accuracy. In this paper, we propose a method to inherently enhance the robustness and inference accuracy of BayNNs deployed in IMC architectures. To achieve this, we introduce a novel normalization layer combined with stochastic affine transformations. Empirical results in various benchmark datasets show a graceful degradation in inference accuracy, with an improvement of up to $58.11\%$.
Internet of Things (IoT) and smart wearable devices for personalized healthcare will require storing and computing ever-increasing amounts of data. The key requirements for these devices are ultra-low-power, high-processing capabilities, autonomy at low cost, as well as reliability and accuracy to enable Green AI at the edge. Artificial Intelligence (AI) models, especially Bayesian Neural Networks (BayNNs) are resource-intensive and face challenges with traditional computing architectures due to the memory wall problem. Computing-in-Memory (CIM) with emerging resistive memories offers a solution by combining memory blocks and computing units for higher efficiency and lower power consumption. However, implementing BayNNs on CIM hardware, particularly with spintronic technologies, presents technical challenges due to variability and manufacturing defects. The NeuSPIN project aims to address these challenges through full-stack hardware and software co-design, developing novel algorithmic and circuit design approaches to enhance the performance, energy-efficiency and robustness of BayNNs on sprintronic-based CIM platforms.
Bayesian Neural Networks (BayNNs) can inherently estimate predictive uncertainty, facilitating informed decision-making. Dropout-based BayNNs are increasingly implemented in spintronics-based computation-in-memory architectures for resource-constrained yet high-performance safety-critical applications. Although uncertainty estimation is important, the reliability of Dropout generation and BayNN computation is equally important for target applications but is overlooked in existing works. However, testing BayNNs is significantly more challenging compared to conventional NNs, due to their stochastic nature. In this paper, we present for the first time the model of the non-idealities of the spintronics-based Dropout module and analyze their impact on uncertainty estimates and accuracy. Furthermore, we propose a testing framework based on repeatability ranking for Dropout-based BayNN with up to $100\%$ fault coverage while using only $0.2\%$ of training data as test vectors.
Printed electronics (PE) technology provides cost-effective hardware with unmet customization, due to their low non-recurring engineering and fabrication costs. PE exhibit features such as flexibility, stretchability, porosity, and conformality, which make them a prominent candidate for enabling ubiquitous computing. Still, the large feature sizes in PE limit the realization of complex printed circuits, such as machine learning classifiers, especially when processing sensor inputs is necessary, mainly due to the costly analog-to-digital converters (ADCs). To this end, we propose the design of fully customized ADCs and present, for the first time, a co-design framework for generating bespoke Decision Tree classifiers. Our comprehensive evaluation shows that our co-design enables self-powered operation of on-sensor printed classifiers in all benchmark cases.
Uncertainty estimation in Neural Networks (NNs) is vital in improving reliability and confidence in predictions, particularly in safety-critical applications. Bayesian Neural Networks (BayNNs) with Dropout as an approximation offer a systematic approach to quantifying uncertainty, but they inherently suffer from high hardware overhead in terms of power, memory, and computation. Thus, the applicability of BayNNs to edge devices with limited resources or to high-performance applications is challenging. Some of the inherent costs of BayNNs can be reduced by accelerating them in hardware on a Computation-In-Memory (CIM) architecture with spintronic memories and binarizing their parameters. However, numerous stochastic units are required to implement conventional dropout-based BayNN. In this paper, we propose the Scale Dropout, a novel regularization technique for Binary Neural Networks (BNNs), and Monte Carlo-Scale Dropout (MC-Scale Dropout)-based BayNNs for efficient uncertainty estimation. Our approach requires only one stochastic unit for the entire model, irrespective of the model size, leading to a highly scalable Bayesian NN. Furthermore, we introduce a novel Spintronic memory-based CIM architecture for the proposed BayNN that achieves more than $100\times$ energy savings compared to the state-of-the-art. We validated our method to show up to a $1\%$ improvement in predictive performance and superior uncertainty estimates compared to related works.
Recently, machine learning systems have gained prominence in real-time, critical decision-making domains, such as autonomous driving and industrial automation. Their implementations should avoid overconfident predictions through uncertainty estimation. Bayesian Neural Networks (BayNNs) are principled methods for estimating predictive uncertainty. However, their computational costs and power consumption hinder their widespread deployment in edge AI. Utilizing Dropout as an approximation of the posterior distribution, binarizing the parameters of BayNNs, and further to that implementing them in spintronics-based computation-in-memory (CiM) hardware arrays provide can be a viable solution. However, designing hardware Dropout modules for convolutional neural network (CNN) topologies is challenging and expensive, as they may require numerous Dropout modules and need to use spatial information to drop certain elements. In this paper, we introduce MC-SpatialDropout, a spatial dropout-based approximate BayNNs with spintronics emerging devices. Our method utilizes the inherent stochasticity of spintronic devices for efficient implementation of the spatial dropout module compared to existing implementations. Furthermore, the number of dropout modules per network layer is reduced by a factor of $9\times$ and energy consumption by a factor of $94.11\times$, while still achieving comparable predictive performance and uncertainty estimates compared to related works.
Neural networks (NNs) are capable of learning complex patterns and relationships in data to make predictions with high accuracy, making them useful for various tasks. However, NNs are both computation-intensive and memory-intensive methods, making them challenging for edge applications. To accelerate the most common operations (matrix-vector multiplication) in NNs, hardware accelerator architectures such as computation-in-memory (CiM) with non-volatile memristive crossbars are utilized. Although they offer benefits such as power efficiency, parallelism, and nonvolatility, they suffer from various faults and variations, both during manufacturing and lifetime operations. This can lead to faulty computations and, in turn, degradation of post-mapping inference accuracy, which is unacceptable for many applications, including safety-critical applications. Therefore, proper testing of NN hardware accelerators is required. In this paper, we propose a \emph{one-shot} testing approach that can test NNs accelerated on memristive crossbars with only one test vector, making it very suitable for online testing applications. Our approach can consistently achieve $100\%$ fault coverage across several large topologies with up to $201$ layers and challenging tasks like semantic segmentation. Nevertheless, compared to existing methods, the fault coverage is improved by up to $24\%$, the memory overhead is only $0.0123$ MB, a reduction of up to $19980\times$ and the number of test vectors is reduced by $10000\times$.
Printed electronics (PE) promises on-demand fabrication, low non-recurring engineering costs, and sub-cent fabrication costs. It also allows for high customization that would be infeasible in silicon, and bespoke architectures prevail to improve the efficiency of emerging PE machine learning (ML) applications. Nevertheless, large feature sizes in PE prohibit the realization of complex ML models in PE, even with bespoke architectures. In this work, we present an automated, cross-layer approximation framework tailored to bespoke architectures that enable complex ML models, such as Multi-Layer Perceptrons (MLPs) and Support Vector Machines (SVMs), in PE. Our framework adopts cooperatively a hardware-driven coefficient approximation of the ML model at algorithmic level, a netlist pruning at logic level, and a voltage over-scaling at the circuit level. Extensive experimental evaluation on 12 MLPs and 12 SVMs and more than 6000 approximate and exact designs demonstrates that our model-to-circuit cross-approximation delivers power and area optimal designs that, compared to the state-of-the-art exact designs, feature on average 51% and 66% area and power reduction, respectively, for less than 5% accuracy loss. Finally, we demonstrate that our framework enables 80% of the examined classifiers to be battery-powered with almost identical accuracy with the exact designs, paving thus the way towards smart complex printed applications.
Printed Electronics (PE) exhibits on-demand, extremely low-cost hardware due to its additive manufacturing process, enabling machine learning (ML) applications for domains that feature ultra-low cost, conformity, and non-toxicity requirements that silicon-based systems cannot deliver. Nevertheless, large feature sizes in PE prohibit the realization of complex printed ML circuits. In this work, we present, for the first time, an automated printed-aware software/hardware co-design framework that exploits approximate computing principles to enable ultra-resource constrained printed multilayer perceptrons (MLPs). Our evaluation demonstrates that, compared to the state-of-the-art baseline, our circuits feature on average 6x (5.7x) lower area (power) and less than 1% accuracy loss.