Wafer-Level Etch Spatial Profiling for Process Monitoring from Time-Series with Time-LLM

Understanding wafer-level spatial variations from in-situ process signals is essential for advanced plasma etching process monitoring. While most data-driven approaches focus on scalar indicators such as average etch rate, actual process quality is determined by complex two-dimensional spatial distributions across the wafer. This paper presents a spatial regression model that predicts wafer-level etch depth distributions directly from multichannel in-situ process time series. We propose a Time-LLM-based spatial regression model that extends LLM reprogramming from conventional time-series forecasting to wafer-level spatial estimation by redesigning the input embedding and output projection. Using the BOSCH plasma-etching dataset, we demonstrate stable performance under data-limited conditions, supporting the feasibility of LLM-based reprogramming for wafer-level spatial monitoring.

ML$^2$Tuner: Efficient Code Tuning via Multi-Level Machine Learning Models

The increasing complexity of deep learning models necessitates specialized hardware and software optimizations, particularly for deep learning accelerators. Existing autotuning methods often suffer from prolonged tuning times due to profiling invalid configurations, which can cause runtime errors. We introduce ML$^2$Tuner, a multi-level machine learning tuning technique that enhances autotuning efficiency by incorporating a validity prediction model to filter out invalid configurations and an advanced performance prediction model utilizing hidden features from the compilation process. Experimental results on an extended VTA accelerator demonstrate that ML$^2$Tuner achieves equivalent performance improvements using only 12.3% of the samples required with a similar approach as TVM and reduces invalid profiling attempts by an average of 60.8%, Highlighting its potential to enhance autotuning performance by filtering out invalid configurations