Quantitative Evaluation of Crack Depths on Thin Aluminum Plate using Eddy Current Pulse-Compression Thermography

Eddy current stimulated thermography is an emerging technique for non-destructive testing and evaluation of conductive materials. However, quantitative estimation of the depth of subsurface defects in metallic materials by thermography techniques remains challenging due to significant lateral thermal diffusion. This work presents the application of eddy current pulse compression thermography to detect surface and subsurface defects with various depths in an aluminum sample. Kernel Principal Component analysis and Low Rank Sparse modelling were used to enhance the defective area, and cross point feature was exploited to quantitatively evaluate the defects depth. Based on experimental results, it is shown that the crossing point feature has a monotonic relationship with surface and subsurface defects depth, and it can also indicate whether the defect is within or beyond the eddy current skin depth. In addition, the comparison study between aluminum and composites in terms of impulse response and proposed features are also presented.

A low-cost flexible instrument made of off-the-shelf components for pulsed eddy current testing: overview and application to pseudo-noise excitation

A flexible and low-cost device for eddy current non-destructive testing made of off-the-shelf components is described. The proposed system is compact and easy to operate, and it consists of a dual H-bridge stepper motor driver, a coil winded in-house on an additively manufactured support, a tunnel magnetoresistance sensor, and a data generation/acquisition module. For the latter, two different commercial devices have been used, and both setups have been then tested on a benchmark sample to detect small artificial cracks. The system can flexibly generate the square pulse or square wave with tunable duration and frequency, as well as pseudo-noise binary waveforms that are here used in combination with pulse-compression to increase the inspection sensitivity with respect to standard pulsed eddy current testing. A benchmark sample was analysed, and all the defects were correctly located, demonstrating the good detection capability of the sensor. This was achieved by assembling a very low-cost handy device, which can be further improved in portability and performances with the use of different off-the-shelf components, and that can be easily integrated with single-board PC, paving the way for future developments in this field.