Abstract:Multimodal large language models have demonstrated strong defect recognition capability in industrial anomaly detection. However, in lithography review, merely determining whether an image contains a defect is insufficient for engineering inspection; models must also understand defect morphology, spatial location, and the potential causes supported by visible evidence. To this end, this paper proposes LDU-Bench, a multi-task multimodal benchmark for lithography defect understanding. Constructed from real lithography and integrated-circuit review images, LDU-Bench decomposes the review workflow into four independent tasks: defect triage, morphology recognition, coarse localization, and image-conditioned cause analysis. It systematically evaluates models using task-level metrics, diagnostic readouts, and the Lithography Closure Score (LCS). Experimental results show that although existing MLLMs can perform defect triage relatively reliably, this ability does not stably transfer to downstream review stages. Morphology alignment, effective localization, and evidence-to-cause mapping remain the major bottlenecks. Further diagnostics indicate that this capability break is not a fluctuation of a single metric, but reflects insufficient structured understanding across semantic levels. Overall, LDU-Bench provides a quantifiable and diagnostic unified platform for evaluating the usability, failure points, and capability boundaries of industrial MLLMs in lithography review chains.
Abstract:Existing industrial anomaly detection methods mainly determine whether an anomaly is present. However, real-world applications also require discovering and classifying multiple anomaly types. Since industrial anomalies are semantically subtle and current methods do not sufficiently exploit image priors, direct clustering approaches often perform poorly. To address these challenges, we propose ProtoAnomalyNCD, a prototype-learning-based framework for discovering unseen anomaly classes of multiple types that can be integrated with various anomaly detection methods. First, to suppress background clutter, we leverage Grounded SAM with text prompts to localize object regions as priors for the anomaly classification network. Next, because anomalies usually appear as subtle and fine-grained patterns on the product, we introduce an Anomaly-Map-Guided Attention block. Within this block, we design a Region Guidance Factor that helps the attention module distinguish among background, object regions, and anomalous regions. By using both localized product regions and anomaly maps as priors, the module enhances anomalous features while suppressing background noise and preserving normal features for contrastive learning. Finally, under a unified prototype-learning framework, ProtoAnomalyNCD discovers and clusters unseen anomaly classes while simultaneously enabling multi-type anomaly classification. We further extend our method to detect unseen outliers, achieving task-level unification. Our method outperforms state-of-the-art approaches on the MVTec AD, MTD, and Real-IAD datasets.
Abstract:Accurate segmentation and measurement of lithography scanning electron microscope (SEM) images are crucial for ensuring precise process control, optimizing device performance, and advancing semiconductor manufacturing yield. Lithography segmentation requires pixel-level delineation of groove contours and consistent performance across diverse pattern geometries and process window. However, existing methods often lack the necessary precision and robustness, limiting their practical applicability. To overcome this challenge, we propose LithoSeg, a coarse-to-fine network tailored for lithography segmentation. In the coarse stage, we introduce a Human-in-the-Loop Bootstrapping scheme for the Segment Anything Model (SAM) to attain robustness with minimal supervision. In the subsequent fine stage, we recast 2D segmentation as 1D regression problem by sampling groove-normal profiles using the coarse mask and performing point-wise refinement with a lightweight MLP. LithoSeg outperforms previous approaches in both segmentation accuracy and metrology precision while requiring less supervision, offering promising prospects for real-world applications.
Abstract:Modern Integrated-Circuit(IC) manufacturing introduces diverse, fine-grained defects that depress yield and reliability. Most industrial defect segmentation compares a test image against an external normal set, a strategy that is brittle for IC imagery where layouts vary across products and accurate alignment is difficult. We observe that defects are predominantly local, while each image still contains rich, repeatable normal patterns. We therefore propose an unsupervised IC defect segmentation framework that requires no external normal support. A learnable normal-information extractor aggregates representative normal features from the test image, and a coherence loss enforces their association with normal regions. Guided by these features, a decoder reconstructs only normal content; the reconstruction residual then segments defects. Pseudo-anomaly augmentation further stabilizes training. Experiments on datasets from three IC process stages show consistent improvements over existing approaches and strong robustness to product variability.